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MN103S33N
Type Command ROM (x 64-bit) x Data RAM (x 32-bit) x Package Minimum Instruction Execution Time Interrupts
MN103S33N 512 K-byte 24 K-byte MBGA360-C-1313A *Lead-free 24.3 ns (at 2.3 V to 2.7 V, 41 MHz) * RESET * IRQ x 15 * NMI * Key input * Timer x 44 * Input capture x 16 * PWM x 8 * SIF x 25 * DMA x 12 * WDT * A/D * System error 8-bit timer x 12 Reload-down count Cascade connection possible (usable as a 16-bit to 32-bit timer) 8-bit timer with PWM x 8 Reload-down count Cascade connection possible (usable as a 16-bit to 32-bit timer) PWM generating function 16-bit timer x 6 Up-down count Input capture function PWM generating function Compare/capture register 2-ch. 16-bit timer x 6 Reload-down count Watchdog timer x 1
DMA Controller
Number of channels: 4 Unit of transfer: 8/16/32 bits Max. Transfer cycles: 65535 Staring factor: external interrupt, timer factor, PWM factor, serial transmission/reception factor, A/D conversion finish, software factor Transfer method: 2-bus cycle transfer Adressing modes: fixed, increment, decrement Transfer modes: word transfer, burst transfer, intermittent transfer Serial 0, 1, 3 to 8, A, B: start-stop synchronization/synchronization/I2C commonly used, 10 lines Serial 2, 9: 2 lines for start-stop synchronization only, serial 2: 10 bytes containing receive FIFO * Common use
Serial Interface I/O Pins
Input A/D Inputs PWM ICR OCR Timer Synchronous Output ROM Collection
Pl
25 4-ch.
I/O
169
10-bit x 25-ch. 12-, 14-bit resolution x 5-ch. output waveform value load control function provided 16-bit resolution x 2-ch. 28-bit x 13-ch. + 16-bit x 6-ch. (common with timer) 16-bit x 12-ch. (common with timer) 4-bit (synchronous output) x 2-ch.
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* Common use
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Timer Counter
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MN103S33N
Pin Assignment
Perspective
PF3,
PF1,
PD5, VDD2
PD2,
N.D.
N.D.
TDI
TM25IOB TM24IOB PF2, PE0,
TM15IO TM12IO
PE5, PE3,
PC4, PC6, SY1OT2, SY1OT0, SBT8 SBI8 PC2, VDD2 SY0OT2 PC1, PB5, BG
PB2, VSS IRQ14 PB4, BR PB1, IRQ13 PB0, PA4, SBO7 PA5, SBT7 P93,
PA2, SBT6 PA0, SBI6 PA3, SBI7 P94,
P91, ICR9 VSS
P87, ICR7 P85, ICR5
P83, ICR3 P60, IRQ8 VSS P84,
P81, ICR1 P80, N.D. ICR0 P62, IRQ10 P54, P63, IRQ11 P33, D27, SBT2 P25, D21, SBT0 P53, P61, IRQ9 N.C.*2 (VDDF) P57, IRQ7 P51, IRQ1 P40, PWM1, TM0IO P35, D29, SBO3 P30, D24, SBT1 P26, D22, SBI1 VSS N.D. N.D. N.D.
W V U T R P N M L K J H G F E D C B A
PD3,
N.D.
N.D. PV2, SBTA PG6, AN6 VSS
TCK PV1, SBOA
TM25IOA TM20IOA TM22IOB TM21IOB TM13IO PE6, PE2, PD4, TM14IO PE4,
AN13 PI5,
AN11 PI3,
AN12 PH7,
AN9 PI1,
AN8 PI0,
AN21
AN19 PI7,
AN15 PH6,
AN17 PI4,
AN16 PI6,
AVSS
AN23 PM1, CS1
AN14 PI2,
AN20
AN22 P70,
VSS
VDDB PM4, CS4
AN18 PM0, CS0
AN24 VSS
PM3, CS3
PN0, WE0, SDQM0 VSS
PN2,
PM5,
PN4, DK
SYSCLK PO0, ADM0, A0 VDDB
VDD
RWSEL PM2, CS2
VDD
PN5, AS
N.D.
PO5, PO1, PN1, ADM5, WE1, ADM1, A5 A1 SDQM1 PO2, ADM2, A2 PN3, RE PO7, ADM7, A7
VSS
PO3, ADM3, A3 PO6, ADM6, A6 N.D.
VSS
PO4, PP2, VDDB ADM10, ADM4, A4 A10 N.D.
PK1, PK7, PK0, PL1, PK5, PP4, ADM12, TM31IO TM35IO TM37IO TM30IO TM4IO A12 PK2, PK6, FRQS
PP7, PJ1, PP3, PP6, PJ0, ADM14, EXMOD0 ADM11, ADM15, A15 EXMOD1 A11 A14 PP0, ADM8, A8 PP5, PP1, ADM9, ADM13, A13 A9
N.D.
N.D.
19 18 17 16 15 14 13 12 11 10
* N.D. has an electrode (pin) but N.C. is not guaranteed. Please design so as not to cause shor t circuit with other wiring on the
* Each of VDDH, VDD, VDDB, VDDF, VDD2, and VSS has multiple electrodes (pins). Connect the same electrode names to the same power supply. *1: Connect the J3, R6, and R12 pins to the VSS for the MN103SF33N. *2: Connect the H1 and T1 pins to the VDDF power for the MN103SF33N.
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Pl
user board.
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N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. VDDH P32, D26, SBO2 N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. P27, D23, SBO1 VSS P31, D25, SBI2 P23, D19, SBI0 N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. P21, D17, SBOB P12, D10 P24, D20, SBO0 P16, D14 P22, D18, SBTB P20, D16, SBIB P13, D11 N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.C.*1 (VSS) P17, D15 P10, D8 N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. VDDH N.C.*2 (VDDF) P11, D9 P02, D2 N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. VSS P00, D0 P15, D13 P07, D7 N.D. N.D. N.D. N.D. N.D. N.D. PL2, N.D. N.D. N.D. VSS P06, D6 P03, D3 P05, D5 PK3, N.D. PVSS MMOD1 VSS TM33IO TM5IO PK4, PL3, RST VDDH CKSEL VDD TM34IO TM6IO PL4, PR1, A20, KI1 PR2, A21, KI2, SWE PQ0, A16 PR7, KI7, PWM5 PS0, PT1, N.D. P04, D4 VOUT PS3, P14, D12 P01, D1 SBO9 PS5, VSS SBI4 PQ2, TM7IO PL5, TM32IO TM36IO PWM6 PL0, OSCI VSS PR0, A19, KI0 PQ1, A17 PVDD MMOD0 OSCO TM3IO A18 PR5, A24, KI5, SDCLKI PR3, A22, KI3, SCKE SBT5 SBI5 PR4, PU0, A23, VDDH WE2, KI4, SDCLKO SCAS PS2, PT0, PS1, SBT4 PR6, A25, KI6 SBI9 SBO4 PT2, VDDH VOUT electrode (pin) none VSS NMIRQ VDDH LON N.D. N.D. PS4, SBO5 SBT9 PU1, WE3, SRAS N.D. N.D.
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TM23IOA TM21IOA PF0,
TDO PV0,
PD1,
PC7,
P92, ICR10 VDD2
P86, ICR6 P82,
TM11IO SY1OT3 SY0OT1
PE7, PE1,
PD0,
PC0,
SBIA PV3,
VREFL PG2, AN2
TMS
TM24IOA TM22IOA TM23IOB TM20IOB TM10IO SY0OT0
IRQ12
ICR11
ICR12 PA1,
ICR2 P90,
ICR4 P56,
IRQ4 P34, D28, SBI3 P43,
ADTRG PG3, AN3
VDD
TRST
N.D.
VDD
N.C.*1 (VSS)
VSS
PC5, PC3, PB3, SY1OT1, SBO8 SY0OT3 WDOVF N.D. N.D. N.D.
SBO6 N.D.
N.C.*1 (VSS) N.D.
ICR8 N.D. P50,
IRQ6 P52,
PG4, AN4
AVDD PG5, AN5
VREFH PG1, AN1
N.D.
N.D.
N.D.
N.D.
N.D.
IRQ2 P55,
PWM4
IRQ3 VSS
PG7, AN7
PH2,
PG0, AN0
N.D.
N.D.
N.D.
N.D.
N.D.
N.D.
N.D.
N.D.
N.D.
AN10 PH4,
IRQ0
IRQ5
P41, PWM2, TM1IO P37, D31, PWM0
PH5,
PH3,
PH1,
PH0,
P36, D30, SBT3
P42, PWM3, TM2IO
9
8
7
6
5
4
3
2
1
MBGA360-C-1313A
*Lead-free
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Support Tool
In-circuit Emulator On-board Development Tools Flash Memory Built-in Type
PX-ICE103S33 PX-ODB103S-O Type Command ROM (x 64-bit) Data RAM (x 32-bit) Minimum instruction execution time Package MN103SF33N 512 K-byte 24 K-byte 24.3 ns (at 2.3 V to 2.7 V, 41 MHz) MBGA360-C-1313A *Lead-free Not applicable to MBGA360-C-1313A
Pl
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MAF00005GEM
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MAF00005GEM
Pl
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M Di ain sc te on na tin nc ue e/ d
MN103S33N
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(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: - Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. - Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.

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